Specification:
Type: HY610-TU25
Color: Golden
Thermal Conductivity: >3.05 W / m-K
Thermal Impedance: <0.073 ℃ -in2 / W
Specific Gravity: >2.48 g/cm3
Viscosity: 1000
Concentration: 380±10 1/10mm
Operating Temperature Range: -30 ~ 240 ℃
Primary Use: Thermal coupling of electrical/electronic devices to heat sinks.
Features:
1. Syringe design, for easy operation.
2. Non-toxic,non-corrosive and ordorless.
3. Helps disperse the heat from CPU to heatsink effectively.
4. High temperature resistance and high conductivity.
5. Suitable for CPU heatsink or chip.
Package Included:
1 x CPU Thremal Paste
